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Zoomtak PCB Assembly includes the manufacturing process of Surface Mount Technology（SMT）, Manual Insertion (MI), Auto-insertion (AI) and Chip on Board(COB). Now we have abundant practical experience on manufacture electronic products.
We are engaged in providing the service for different fields, like Computer Interface Products, Communication products, Automation products and Automotive Products. And we use IPC-610 as our manufacturing standard. The products can also be strictly compliant with ROHS and WEEE to meet the new environmental protection requests.
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Our SMT Equipments and Capabilities |
Equipment |
LINE1: |
Semi-auto printer +MSH2 + MV2C-A + MPA-3 + 台技回流焊 |
LINE2: |
SPP-G1 + MSH2+MV2F + MPA 3+ FLEXTRONICSREFLOWER |
LINE3: |
DEK ELA+ MSH2 + MV2F + MPA-3 + KELONG REFLOWER |
LINE4: |
DEK 265GSX + MSHG1 + MV2F + MPA-G1 + HELLER 1800W |
LINE5: |
SPPD + TCM3500Z + HELLER 1800EXL |
Capabilities |
-SMT with 5 million placements per day
-Manual Insertion with output 600,000pcs components per day
-CHIP mounting speed is 0.3S/unit, high-point speed is 0.16S/unit |
Mount Precision |
Pick and Place machine can assemble fine pitch chips such as 0201 size chip, Mounting precision can meet 0.1mm. Multi-functional machine can match 0.3 pitch packages such as PLCC, QFP, BGA, CSP and so on. |
Special Manufacturing Technologies |
-Reflow Oven with Nitrogen support
-Clean Booth with Class 100K degrees
-DIP can match the assembly of standing and lying parts and jumper |
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